Since 1984, ECS has been developing customized wire harness assemblies and wire harness components for the aviation, medical, and industrial markets that offer high-reliability and proven performance. Backed by this record of success and our state-of-the-art manufacturing facility, we can offer our customers a complete solution from intelligent product design to turnkey manufacturing and assembly. Our fabrication process meets all critical industry standards and utilizes top quality materials that comply with Mil-Spec and customer specifications, as well as all requirements set forth by Federal Aviation Regulations PART 25.

Each ECS wire harness is custom designed for the required application and is fully tested to guarantee electrical and physical integrity, compliance with system requirements, and adherence to airframe manufacturers’ and original OEM standard practices. To ensure production repeatability, ECS wire harness assemblies are constructed on specially designed patterns with complete records kept for traceability.

Special Design Considerations:

While ECS offers standard wire harness assemblies, when required, our manufacturing technology can incorporate custom design features such as:

Fiber optic cable integration and termination to meet all industry standards for signal loss and bend radius critical tolerances
Aircraft-grade computer harnessing to accommodate USB, IEEE 1394, Ethernet, SCSI, In-Flight Video (including LVDS), and other data bus interfaces
Special sealants, epoxies, and abrasion-resistant covers to withstand even the most rigorous environments
Unique temperature-controlled wire harness designs to perform in radioactive environments

ECS Wire Harness Technology Offers:

Custom designs built to system specifications
Single- or double-end termination
State-of-the-art labeling techniques including Laser Marking, Ink Jet Marking, Wrap Around, Flags, Databs, Heat Shrink, Placards, Tie Wrap, and Hot Stamping
Automated testing to guarantee full electrical and physical performance including High Pot, Insulation Resistance, Connection Resistance, Micro Ohmmeter Bonding, and Life-Cycle Testing
Bend radius critical tolerances with built-in added rigidity or flexibility when needed
Protection against EMI and air or fluid ingression
Products that meet all FAR Part 25 requirements